Manufacturing
- State of the art machinery and facilities with 100k controlled manufacturing environment ensures best possible output and quality
- Proven World Class delivery and quality performance
- Advanced packaging technology provider for electronic modules
- Low Temperature Co-Fired Ceramics (LTCC)
- Thick Film Hybrids
- Flex based substrates
- Glass
- FR4
- Complete range manufacturing process including SMD, Die bonding, wire bonding, encapsulation, laser trimming of passives, functional trimming, AQI (X-Ray inspection, ageing, testing).
- ISO 9001:2000
- Audited by worlds leading companies operating in Medical, Military, Aerospace, Telecom, Automotive and Industrial sectors
